#4,500,874 (-18%) - besi.com
Title: Besi - die sorting, die bonding, packaging and plating equipment for semiconductor industry
Description: Besi and its product groups Datacon, Esec, Fico and Meco are supplier of die sorting, flip chip and multi chip die bonding, packaging and plating equipment for the semiconductor industry.
Keywords:Die Sorter, Flip Chip, Die Bonder, Advanced Packaging, Packaging, Plating, Epoxy, LED, Wire Bonder, Solar