#0 (0%) - imi-corp.com
Title: International Micro Industries, Inc.
Description: International Micro Industries (IMI) offers state of the art Wafer Bumping and Wafer Level Packaging WLP contract services via high aspect ratio, high precision electroplating and photolithography technology. IMI offers complete solutions; wafers from re
Keywords:Wafer Bumping, Wafer Bumping Contract Services, Wafer Level Processing, Wafer Level Packaging Contract Services, WLP, Wafer Electroplating, High Aspect Ratio Electroplating, Electroplating, UBM, Thick Photoresist, Gold Bump, Gold Bumping, Au Bumping, Solder Bumps, Solder Bumping, Tin Lead Bumps, Pillar Bumps, Copper Pillar Bumps, Copper electroplating, Indium Bumps, Indium Bumping, Gold/Tin Bumps, Au/Sn Bumps, Au/Sn Bumping, Known Good Packaging,
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