Title: Sikama International, Inc
Description: SIKAMA's innovative line of reflow soldering systems includes both straight conduction systems and SIKAMA's patented Conduction+Convection furnaces.
Keywords:
reflow,
BGA,
ball grid array,
solder,
soldering systems,
IR reflow,
convection,
convection/IR,
conduction,
conductive reflow,
ultra profile,
falcon,
belt oven,
beltless oven,
ball reflow,
flip chip reflow,
curing systems,
curing ovens,
furnace,
die attach