#0 (0%) - ox3.com
Title: Tape and Reel
Description: OX3 Corporation provides semiconductor services including tape and reel, flash programming, baking, lead repair, BGA rework, carrier tape, integrated circuit testing, lead inspection, lead conditioning, BGA reballing, product identification, ink marking,
Keywords:Tape and Reel, taping and reeling, OX3, Semiconductor Handling, Carrier Tape, Plastic Carrier Tape, Semiconductor tape, Reel, Plastic reel, flash programming, NOR Flash, NAND Flash, baking, semiconductor baking, baking JEDEC, JEDEC tray, moisture sensitivity level, moisture sensivity, MSL, MSD, ESD, lead repair, BGA rework, integrated circuit testing, semiconductor,
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lead inspection, conditioning, BGA Reballing, CBGA Reballing, reballing solder, BGA pad rework, product identification, ink marking, programmable logic device, TO-92, Microcontroller Programming, E-PROM Programming, Programming Certificate, Testing, Sorting, Inventory Services, Radial Lead, Axial Lead, Surface Mount, Vision Inspection, EE-PROM Programming, Vacuum Dry Pack, Lead Trim, Lead Form, Lead Conditioning, fine pitch, Lead Reconditioning, Through Hole, SMD Reel, Reelpak, Reelquick, ABK, BQFP, CBGA, CCGA, CERDIP, CERQUAD, Chip Cap, Chip, Chip Resistor, Chip Capacitor, CLCC, Connector, CPGA, CQFP, Crystal, CSOJ, DFN, DIP, DPak, DQFN, DSBGA, FBGA, FET, Flatpack, GDIP, Heatsink, HSSOP, Inductor, KDIP, LCC, LDCC, LGA, LLCC, LSOJ, LTCC, MSOP, Odd-Form, Optocoupler, Oscillator, PBGA, PDIP, PFP, PGA, PKDIP(View Less)